SEOUL, South Korea – In a significant announcement during Samsung Electronics’ annual general shareholders’ meeting held on Wednesday, co-CEO Kye-Hyun Kyung revealed optimistic financial forecasts for the company’s burgeoning advanced chip packaging sector. The establishment of advanced chip packaging as a distinct business unit in the previous year marks Samsung’s strategic pivot towards enhancing its capabilities in semiconductor manufacturing, a critical area that has seen escalating demand due to the global surge in technology usage.