Early multiphysics; high-speed M-PHY; STCO for 3D-ICs; what EDA needs for AI; workload optimization. In a podcast, Siemens’ Tova Levy chats with Intel Fellow Sujit Sharan about why system technology co-optimization is crucial for 3D-ICs and how standardized data exchange and cloud-based collaboration remain critical gaps. Keysight’s Pedro Pires suggests organizations implement standardized data interfaces, ensure transparency in model training, and invest in orchestration platforms to get the most out of AI in EDA. Technology strategy advisor Geoff Tate looks at how data center AI can keep growing, despite supply chain bottlenecks. Cadence’s Steve Brown observes that AI agents can understand design intent and implement meaningful portions of the design process.