TSMC says its production 5.5-reticle-size CoWoS packaging technology can achieve yields approaching 99% on selected products. CoWoS places large logic dies and multiple HBM stacks on an interposer, making the complete package considerably larger and more complex than a conventional processor. The quoted figure should not be interpreted as a universal yield for every CoWoS product. TSMC plans to increase CoWoS scale further, targeting a 15-reticle-size platform in 2029. Strong packaging yield increases the number of sellable accelerators produced from available logic and HBM components, while reducing the economic impact of exceptionally expensive defective assemblies.