SiCr films play a critical role in BCD technology, primarily as precision resistive elements within analog and power management circuits. About picosecond ultrasonic technologyPicosecond ultrasonic technology (PULSE technology) is a non-contact, non-destructive pump-probe laser acoustic technique for the measurement of metal film thickness. To demonstrate this, we measured the nominal thickness of SiCr thin films using picosecond ultrasonic technology. SummaryAs demonstrated, picosecond ultrasonic technology provides a precise, non-destructive method for measuring film thickness, validated against TEM calibration. In the following blog, we will examine how picosecond ultrasonic technology can provide additional insight.