Researchers from A*STAR published a technical paper titled “FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5D Systems.” Abstract Excerpt: ” We propose FAPlace, a footprint aware mask guided sequential placement framework. At its core is a novel footprint mask that fuses area compactness with an aspect ratio penalty into a unified spatial cost map. Experimental results demonstrate that FAPlace reduces wirelength and footprint area while achieving near-unity aspect ratios, without compromising on thermal performance.” “FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5 D Systems.”