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Model Tracks Bond Front Velocity in Lubrication-Mediated Bonding of Flexible Substrates (imec)
['Technical Paper Link', 'Tom Katsioulas', 'Alex', 'Matt Bailey', 'Alexis R. Ware', 'Yağız Boz', 'Murugavel Ganesan', 'F. Chen', 'B.S. Deepaksubramanyan', 'Brian Bailey']
Semiconductor Engineering
An imec researcher published a technical paper titled “Bond Front Velocity in Lubrication-Mediated Bonding of Flexible Substrates.”
The progression of a bond front hinges on balance of adhesion and dissipation forces.
Here, a lubrication–elasticity model is reported, to elucidate near-field dynamics of the process while staying within continuum limits, excluding adhesion mechanisms.
This approach for expressing the bond front velocity allows for its acceleration as the unbonded region shrinks, for example with bond front approaching the edge of a finite substrate.
“Bond Front Velocity in Lubrication-Mediated Bonding of Flexible Substrates.”