Apple and its suppliers are scrambling to secure enough DRAM (mobile memory chips) ahead of the expected September 2026 launches of the iPhone 18 series and the foldable iPhone Ultra, according to semiconductor analyst Tim Culpan’s exclusive reporting for Culpium. The issue stems from Apple’s A20 Pro chips (built on TSMC’s 2nm process), which use Wafer-Level Multi-Chip Module (WMCM) packaging that integrates the processor and DRAM at the wafer level. The foldable iPhone Ultra, with its more complex design and lower planned volumes (historically projected in the low millions for the second half of the year in related analyst notes), is viewed as particularly vulnerable to limited availability. Culpan’s sources indicate Apple plans roughly 200 million combined units across the iPhone 18, 18 Pro, and Ultra over the product cycle, with the Ultra representing under 10%. ‎MacDailyNews Take: Buyers interested in the new Pro models or the Ultra at launch would be advised to pre-order very, very promptly!