introduced a unified AI memory platform that combines SRAM with higher on-chip memory density, as well as 3D DRAM that uses 3D NAND manufacturing processes to increase HBM capacity. The vertically integrated facility is intended to manufacture, package, and test AI chips for Tesla vehicles and robots and SpaceX compute systems. The vertically integrated facility is intended to manufacture, package, and test AI chips for Tesla vehicles and robots and SpaceX compute systems. Acrab raised $130M for its agentic AI platform that combines edge silicon, models, and SW orchestration. released a new hardware security module built to provide quantum-resistant security, including PKI, certificate management, authentication, digital signing and identities.