zHBM : Samsung’s vision for custom HBM ultra-high-performance memory that will sit on top of logic dies. zNAND-O : NAND memory that can be bonded atop a logic device to maximize bandwidth, reduce latency, and minimize power consumption. : NAND memory that can be bonded atop a logic device to maximize bandwidth, reduce latency, and minimize power consumption. 21.0 Gb mm^2 20 mm^2 >20 Gb mm^2 19.8 Gb mm^2 Architecture TLC TLC QLC TLC QLC TLC TLC TLC QLC Die Capacity 1 Tb 1 Tb ? 1 Tb 2 Tb 1 Tb 1 Tb 1 Tb 1 Tb I/O Speed Up to 5600 MT/s Up to 3200 MT/s Up to 4800 MT/s Up to 4800 MT/s Up to 3600 MT/s Up to 3600 MT/s ?