Samsung unveils 3D memory vision for AI infrastructure News | August 6, 2026 By Asma AdhimiSamsung Electronics has outlined a new generation of 3D memory products aimed at improving the performance and energy efficiency of AI infrastructure. zHBM moves memory above the acceleratorSamsung unveiled concept models of zHBM and zNAND-O during a keynote titled “Driving the Wave of AI Revolution: 3D Innovations in Memory & Storage Architecture.” The unveiling comes 13 years after Samsung introduced its first V-NAND technology at the 2013 Flash Memory Summit. HBM and enterprise storage roadmapSamsung’s wider FMS portfolio included HBM4E, an HBM5 model, LPDDR5X-PIM and enterprise storage products. Samsung also displayed its PM1763 and BM1773 enterprise storage products for AI data centers.