NEO Semiconductor launches NEO.AI memory platform News | August 6, 2026 By Asma AdhimiNEO Semiconductor has launched NEO.AI, a memory platform combining new SRAM and DRAM architectures to tackle capacity bottlenecks in AI processors. The company claims its X-SRAM technology can provide up to five times greater on-chip memory density, while 3D X-DRAM could increase high-bandwidth memory (HBM) capacity by as much as tenfold. Together, they provide a scalable memory foundation for the next generation of AI systems and represent an important step toward breaking the AI Memory Wall.” 3D X-DRAM targets larger HBM stacksThe second part of the platform, 3D X-DRAM, applies established 3D NAND manufacturing techniques to DRAM. Its wider intellectual property portfolio includes X-HBM, X-NAND and 3D X-AI alongside the newly introduced NEO.AI platform.