The US Department of Commerce has announced plans to provide up to $874m in federal funding to seven technology companies under the CHIPS and Science Act, aiming to accelerate next-generation semiconductor research and strengthen the semiconductor supply chain. Meanwhile, Multibeam Corporation has been selected for up to $140m to advance semiconductor packaging technologies that stack multiple chips into a single system. Advanced packaging is becoming increasingly important as manufacturers seek higher computing performance without relying solely on smaller transistor sizes. Supporting the future of AI infrastructureSeveral smaller awards focus on technologies designed to improve efficiency, connectivity and security across the semiconductor supply chain. Strengthening the semiconductor supply chainBeyond supporting individual technologies, the investments form part of a broader strategy to build greater domestic resilience across the semiconductor supply chain.