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Co-Packaged Optics (CPO) foundry roadmaps — breaking down TSMC, Intel, Samsung, and GlobalFoundries' approach to next-generation scale-up connectivity
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So far, only four foundries have publicly articulated meaningful CPO manufacturing strategies: Intel Foundry, GlobalFoundries, Samsung Foundry, and TSMC.
Meanwhile, so far, Intel has not unveiled plans to use its CPO technology for switches.
GlobalFoundries: A bespoke vendor-agnostic OCI-MSA CPO platformUnlike Intel Foundry, Samsung Foundry, and TSMC, GlobalFoundries does not produce or intend to produce AI processors, switch ASICs, or advanced packages.
Customers then co-package the optical engine alongside their own switch ASICs or AI accelerators.
Among foundries, TSMC, Intel, Samsung Foundry, and GlobalFoundries have each developed distinct CPO strategies that range from merchant optical engines to optical I/O chiplets and vertically integrated CPO platforms.