Japan’s Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced its third-generation (Gen 3) DDR5 Multiplexed Rank Dual In-Line Memory Module (MRDIMM) chipset solutions, delivering DDR5 server-class MRDIMM speeds up to 16,000 mega transfers per second (MT/s). The new solutions are designed to address the growing demand for higher memory bandwidth driven by artificial intelligence (AI) data centers, cloud infrastructure and accelerated compute workloads, Renesas said in a press release. Renesas’ Gen 3 MRDIMM solutions deliver 25 percent higher memory bandwidth than its second-generation solutions, while continuing to use existing DDR5 infrastructure. MRDIMM Gen 3 builds on the proven MRDIMM architecture introduced with Gen 2, extending performance and preserving standard DIMM form factors and system compatibility. “Innovations in next-generation memory form factors such as MRDIMM and Renesas’ chipset are important to helping the industry deliver higher bandwidth, greater efficiency and continued platform scalability.”