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Sandisk and SK hynix release standard specifications for High Bandwidth Flash (HBF) through OCP
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At the Future of Memory and Storage (FMS) 2026 conference in Santa Clara, California, Sandisk Corporation and SK hynix Inc. announced the release of the first standard specifications for High Bandwidth Flash (HBF).
The release comes six months after the formation of the HBF technology workstream under OCP in February 2026, following an initial standardization partnership between Sandisk and SK hynix in August 2025.
Key Technical SpecificationsHBF technology introduces a memory layer positioned between High Bandwidth Memory (HBM) and Solid State Drives (SSDs).
By publishing the specifications openly through OCP, Sandisk and SK hynix aim to build an early-stage ecosystem, improve interoperability, and enable HBF to coexist alongside existing HBM architecture.
SK hynix Exhibits 375-Layer V10 4D NANDAlongside the HBF announcement, SK hynix revealed its tenth-generation (V10) 375-layer 4D NAND wafer and product prototypes for the first time.