TSMC is ahead of schedule in the construction of its $49 billion 1.4nm fab in Taichung’s Central Taiwan Science Park, reports the Commercial Times. First silicon could be running in April 2027 and, if that goes well, the first trial production run could be in Q3 2027. Assuming that is a success, mass production would start by mid-2028. The process will use the second generation of TSMC’s GAA transistor and will not use ASML’s latest High-NA EUV lithography machine. Samsung is also targeting 2029 for its 1.4 nm process.