Wafer Fab Equipment (WFE) sales revenue is expected to grow from $129 billion in 2025 to nearly $220 billion by 2031, a 9% CAGR, with cumulative sales exceeding $1.2 trillion, reports Yole. Market drivers are higher equipment intensity across advanced logic, DRAM/HBM, NAND, and advanced packaging. This market structure reflects the high barriers to entry and long qualification cycles required to scale process-specific equipment into high-volume manufacturing. Wafer bonding, though under 1% of the market in 2025, is forecast to outgrow the overall market with more than 10% CAGR to 2031. By device application, advanced logic (less than 7nm) represented 27% of WFE revenue in 2025 and is expected to reach about 34% by 2031.