Its AP business delivered a record half-year performance, driven by robust demand across Thermo-Compression Bonding (TCB), Photonics and high-precision SMT solutions. Both SEMI and SMT registered strong revenue growth due to AI tailwinds. Photonics: Pluggable Optical Transceiver solutions revenue almost tripled YoY, driven by customer capacity ramps for high-speed optical transceivers for 800G and beyond. Flip Chip High Precision Die-Bonding (FC): FC’s revenue registered strong growth for customers that require high-throughput, large-format applications, and cost efficiency. Bookings growth was also underpinned by demand for optical transceivers and China's EV segment.