The National Institute of Standards and Technology said Wednesday the incentives, authorized under the CHIPS and Science Act, are intended to fund R&D efforts for integrated photonics, advanced packaging, compute architectures, substrates, materials and memory for next-generation computing and artificial intelligence systems. The federal push for advanced semiconductor research comes as agencies continue building the AI and compute infrastructure needed to support future missions. Secretary of Commerce Howard Lutnick said the funding is meant to build domestic capabilities, create jobs and support the semiconductor industry. According to the company, the proposed funding will support development of next-generation silicon photonics, optical materials, wafer technologies and advanced packaging intended for AI and high-performance computing applications. Kepler will receive $245 million to develop AI memory technology based on 3D and ferroelectric architectures, while Multibeam has been allotted $140 million for advanced packaging work.