The company’s key product in this AI boom is its thermo-compression bonding tools, known as TCB tools. AdvertisementIn December 2025, ASMPT secured orders for 19 chip-to-substrate TCB tools specifically built for AI and HPC applications. He noted that the introduction of cheaper, more accessible AI models could actually increase long-term demand for AI chips rather than reduce it. More chips mean more packaging. The December 2025 TCB tool orders and the strong first-half 2025 bookings suggest the company is in the early innings of a sustained demand cycle.