Panel-level packaging, glass carriers/substrates, hybrid bonding, and HBM integration are making warpage harder to control because stress accumulates across materials, thermal steps, and larger geometries. Why warpage is getting worseSeveral converging forces are making warpage harder to control. But advanced packaging increasingly needs “shape metrology,” the dense surface data that can connect deformation signatures to process fingerprints and yield outcomes. A substrate that is flat at room temperature may be anything but flat at operating temperature, which is what really matters. Advanced Packaging Limits Come Into FocusMechanical and process control limits are now shaping what can be manufactured at scale.