The agreement spans high-bandwidth memory, advanced foundry processes and chip packaging for future AI infrastructure. The partnership covers memory, foundry and packagingAccording to Samsung’s official announcement, Samsung and Broadcom plan to work on HBM products for Broadcom’s next-generation AI accelerators. Samsung described the arrangement as an MOU and said the collaboration is estimated to exceed $200 billion through 2030. Cloud companies increasingly use custom accelerators for AI, creating more demand for specialised chip manufacturing, HBM and advanced packaging. Broadcom could bring long-term production volume and help Samsung prove its advanced manufacturing processes at scale.