The impetus behind Microchip Technology’s 3.3-kV HV‑D3 mSiC power modules is to simplify and accelerate the adoption of solid-state transformers (SSTs) in AI hyperscale data centers and other high‑voltage power applications. Solid-state transformers represent a foundational shift in power delivery, reducing conversion stages and enabling higher system efficiency. The HV‑D3 mSiC modules are engineered to meet these requirements by integrating 3.3-kV silicon-carbide (SiC) mSiC MOSFETs and Schottky diodes in an industry‑standard 62-mm package, enabling efficient power delivery from the medium‑voltage grid directly to the server rack. The HV‑D3 mSiC power modules are available in half‑bridge and common‑source configurations with and without anti‑parallel Schottky diodes, addressing applications in the 100- to 300-A range. Development ToolsThe power modules are supported by an application note, design guide, and device and simulation models for rapid prototyping.