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NVIDIA commits $1.5 billion to expand US capacity for next-gen advanced chip packaging
['Neetika Walter']
Interesting Engineering
NVIDIA is partnering with semiconductor packaging company Amkor Technology to develop advanced packaging and testing technologies for next-generation AI and accelerated computing systems, while helping expand Amkor’s US capacity in Arizona.
NVIDIA will also provide a prepayment to support the expansion of Amkor’s US advanced packaging capacity.
Amkor already provides advanced packaging solutions for NVIDIA products, including data center processors, networking chipsets and accelerated computing systems.
For NVIDIA, the partnership also helps secure access to advanced packaging capacity as its hardware portfolio grows.
Amkor plans to expand its advanced packaging operations in Arizona, adding US capacity to its existing manufacturing footprint across Asia.