To address this fast-evolving challenge, Henkel Adhesive Technologies has launched Bergquist Gap Filler TGF 6500LVO, a next-generation thermal gap filler with 6.5W/m∙K thermal conductivity. Pillars of performance: conductivity, flexibility and reliabilityBergquist Gap Filler TGF 6500LVO is a 2-component thermal gap filler based on low-volatile silicone technology. With fast, robust dispensing characteristics, Bergquist Gap Filler TGF 6500LVO is suited to automated production lines and high-throughput manufacturing. Next-generation series evolves in line with customer needsBergquist Gap Filler TGF 6500LVO joins Bergquist Gap Filler TGF 2100LVO, Bergquist Gap Filler TGF 2900LVO, Bergquist Gap Filler TGF 4400LVO and Bergquist Gap Filler TGF 10000 in a product portfolio that enables customers to select materials that match their required thermal performance. “Bergquist Gap Filler TGF 6500LVO is exceptionally thermally conductive, and high-performing.