AcceleRate® HP high-performance array connectors feature 112 Gbps PAM4 performance, a flexible open pin field design, and a highly reliable Solder Column Termination. New Albany, IN: Samtec, Inc., a global leader in high-performance interconnect solutions and a service leader in the industry, announces the expansion of its AcceleRate HP product line with the release of 800-position APM6 and APF6 high-performance array connectors available in a low-profile 5mm stack height. Engineered for next-generation demands, the new AcceleRate HP connectors deliver exceptional signal integrity and density, supporting data rates up to 112 Gbps PAM4 on a 0.635mm pitch. These connectors are optimized for high-throughput applications such as High-Performance Computing (HPC), Artificial Intelligence (AI), storage, and networking. “These new 800-position connectors represent a significant advancement in high-density, high-speed interconnect technology,” said Eric Mings, Samtec’s High-Speed Board-to-Board Product Manager.