In connected car news are Seeing Machines, Volkswagen, Rivian, LG, Xbox, Zoom, Qualcomm, Wolfspeed, Pirelli, Aston Martin, HERE and AWS. The 200mm SiC wafers feature enhanced doping and thickness uniformity, setting new standards for efficiency and competitiveness. The company is also introducing 200mm SiC epitaxy for immediate qualification, designed to deliver scalability, improved quality, and enhanced performance for next-generation power devices. The 200mm SiC bare wafers feature 350µm thickness and industry-leading doping and thickness uniformity, while the epitaxy layer improves MOSFET yields and accelerates time-to-market. Together, Samsung and Valens plan to accelerate its adoption, delivering cutting-edge automotive solutions that enhance safety, reliability, and performance in next-generation mobility.