Teardown of the Huawei 910C AI chip confirms that a critical part of it is built on foreign components. At the current production pace, Huawei is expected to churn out 653,000 Ascend 910C chips that use two TSMC dies, and have enough TSMC die stocked for production until next summer. Getting high-bandwidth memory to package with the TSMC chips has been much harder, though. Still, HBM will reportedly present the main bottleneck in Huawei Ascend 910C AI chip production going forward. The 910C is somewhat shoddily packaged and prone to thermal inefficiencies, and Huawei still has to make millions of AI chips to satisfy domestic demand.