The technology is based on "microfluidics" and involves pumping liquid coolant through tiny channels etched directly into silicon chips. In a statement , Microsoft representatives said the technology was up to three times more effective at removing heat compared with conventional "cold plate" methods for cooling data centers. These generate far more heat than earlier generations of computer chips, with Microsoft warning that current cooling technology could max out data center performance in "just a few years." Beyond better thermal control, Microsoft hopes microfluidics could allow for overclocking — safely pushing chips beyond their normal operating limits without burning them out. Future applications may include cooling 3D-stacked chips, which are notoriously hard to design due to the heat buildup between layers.