In early September, the partners said they were working together to develop scalable AI infrastructure based on co-packaged optics (CPO) technology, with the solution set to offer an ultra-high bandwidth, low latency, and energy-efficient solution for AI clusters. The partners will also work with TSMC on the project, using the chipmaker’s advanced packaging and process technology, including COUPE, TSMC-SoIC, and advanced process nodes. According to a presentation delivered by the two companies at TSMC’s North America OIP Ecosystem Forum last week, the new solution will feature Ayar Labs’ TeraPHY optical engines co-packaged with Alchip’s advanced solutions on a common substrate, bringing optical I/O directly to the AI accelerator interface.