Exploring China’s evolving role in advanced packaging

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Advanced packaging comes in many flavours. JCET’s focus for the past few years and into the future is on nothing but advanced packaging. These are focused research projects on key aspects of advanced packaging like 2.5D/3D technology, interconnect architecture and optical technologies, and bonding. There will be little use in having the latest advanced packaging lines if even Chinese design firms fear using them. They are attracting not just investment from the likes of Samsung, Intel, and Amkor, but also Chinese packaging firms.