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TSMC to break ground on first European 12-inch plant in Dresden, Germany, tomorrow
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TechNode
Wei will lead around 100 employees tomorrow to a grand event where the leading chip manufacturer will break ground on its first European 12-inch plant in Dresden, Germany, according to the Taiwanese media outlet Economic Daily News.
The facility, with an initial monthly capacity of 40,000 wafers, will introduce 28/22nm planar CMOS (complementary metal-oxide-semiconductor) technology and 16/12nm FinFET (fin field-effect transistor) processes.
In August 2023, TSMC, Bosch, Infineon, and NXP Semiconductors announced the formation of the European Semiconductor Manufacturing Company (ESMC), with each firm holding a 10% stake.
With a total investment of 10 billion euros, the German plant will operate under ESMC and is expected to start by late 2027.
[Economic Daily News, in Chinese]Related
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