At the Huawei Connect conference Thursday, rotating chairman Eric Xu said the company will follow "a one-year release cycle and double compute with each release." Huawei outlined a roadmap for its Ascend series of AI chips through 2028 and announced plans for Kunpeng server chip upgrades in 2026 and 2028. Xu also said Huawei had developed proprietary high-bandwidth memory, a technology previously dominated by South Korea's SK Hynix and Samsung Electronics. Huawei also plans to assemble more than 500,000 chips into an Atlas 950 SuperCluster and more than 1 million into the Atlas 960 version. "For Huawei to come out at this point and openly show strength with its AI chips ... there's growing confidence U.S. export controls are not really threatening this process anymore," said Tilly Zhang of Gavekal Dragonomics.