Taipei, Sept. 23 (CNA) Taiwan-based smartphone IC designer MediaTek Inc. on Monday unveiled its latest flagship 5G Agentic AI chipset, the Dimensity 9500, which uses Taiwan Semiconductor Manufacturing Co.'s (TSMC) advanced third-generation 3-nanometer process. Powered by TSMC's 3nm process, the latest technology the chipmaker started mass production, the Dimensity 9500's ultra core processor achieves up to 55 percent lower power consumption at peak performance, MediaTek said. In addition, MediaTek said the Dimensity 9500 delivers up to 32 percent higher single-core and 17 percent higher multi-core performance compared to the previous generation. MediaTek said the Dimensity 9500 is designed to set new standards in on-device AI, console-class gaming, and power efficiency, powering the next wave of flagship 5G smartphones. "The MediaTek Dimensity 9500 delivers exactly that: Breakthrough on-device AI, top-tier performance and efficiency, and a full suite of premium experiences that our partners can bring to users around the world," Hsu said.