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KIOXIA Introduces QLC UFS 4.1 Embedded Flash Memory Devices for High-Capacity Mobile Storage
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EEJournal
Designed for read-intensive applications and high-capacity storage needs, the new devices are powered by KIOXIA’s 8th generation BiCS FLASHTM 3D flash memory technology.
QLC UFS offers a higher bit density than traditional TLC UFS, making it suitable for mobile applications that require higher storage capacities.
Advancements in controller technology and error correction have enabled QLC technology to achieve this while maintaining competitive performance.
KIOXIA’s 8th generation BiCS FLASHTM 3D flash memory introduces CMOS directly Bonded to Array (CBA) technology – an architectural innovation that marks a step-change in flash memory design.
From the invention of NAND flash memory to today’s renowned BiCS FLASHTM 3D flash memory KIOXIA continues to pioneer innovative memory solutions and services that enrich people’s lives and expand society’s horizons.