Evonik has introduced a new debonding-on-demand process designed to promote a circular economy in the production of composite materials and bonded components. The concept was developed jointly by the strategic innovation unit Creavis and the Comfort & Insulation business unit. The focus is on an adhesive system that can be detached from substrates by targeted heat treatment (between 80 and 150°C) – without damaging the components. Reading Tip: Adhesives and SealantsThe book Formulating Adhesives and Sealants provides a two-step approach to adhesive and sealant formulation. Integration into existing processes possibleThe new technology is characterised by low viscosity and broad applicability.